Apparatus, System and Method for Repairing a Test Contact Arrangement
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Mar 16, 2023
filing date -
Mar 16, 2023
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Abstract
An apparatus for repairing a test-contact arrangement includes: a movable arm at whose end effector at least one heat-conductive receptacle is formed, at which a heat-absorption surface is formed; a control device configured for controlling a movement of the arm; a heating device configured for heating the heat-absorption surface; and a temperature measuring device configured for measuring a radiation temperature of a solder material of the solder connection. The receptacle is configured for receiving at least one heat-conductive blade element, and the control device is configured for moving the blade element via a movement of the arm in relation to the test-contact arrangement to sever the at least one solder connection so that at least one solder bridge to be repaired is removable.
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