Sensor Module

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250076335A1
SERIAL NO

18820457

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Importance

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Abstract

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A sensor module includes: a substrate having a first surface and a second surface that are in a front-back relationship with each other, and side surfaces including a first side surface; a first relay substrate having a first front surface and a first back surface and mounted on the first side surface with the first back surface facing the first side surface, the first front surface and the first back surface being in a front-back relationship with each other; and a first inertial sensor including a first package mounted on the first front surface of the first relay substrate and a first sensor element housed in the first package.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SAKUMA, Masayasu Shiojiri, JP 30 110

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