LIQUID-COOLING HEAT SINK WITH TURBULENCE STRUCTURE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250075989A1
SERIAL NO

18240233

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Abstract

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A liquid-cooling heat sink includes a substrate, a fin assembly, and a housing. The substrate has a longitudinal direction. The fin assembly is arranged on the substrate and includes multiple fins arranged at interval to form flow channels along the longitudinal direction. Each flow channel includes an inlet and an outlet opposite to each other. A turbulence structure divides a cross-section of at least one of the flow channels into at least two diverging passages. The housing arranged on the substrate covers the inlets and includes an inlet port and a chamber. Accordingly, the number of fins may be increased in a fixed space, and each flow channel has a smaller cross-sectional area to increase flow velocity of a dielectric liquid. Moreover, this reduces the flow resistance of the dielectric liquid in a turbulent flow area in each flow channel to improve the heat dissipation efficiency.

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Patent Owner(s)

Patent OwnerAddress
JWS TECHNOLOGY CO LTD9F NO 300 JIANGUO 1ST RD XINZHUANG DIST NEW TAIPEI CITY 242047

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Chih-Wei New Taipei City, TW 315 1688
LIAO, Pang-Hung New Taipei City, TW 19 70
WANG, Shih-Ming New Taipei City, TW 72 822

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