CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR

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United States of America

APP PUB NO 20250074763A1
SERIAL NO

18950525

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Abstract

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The present disclosure relates to an integrated chip structure. The integrated chip structure includes a MEMS device. The MEMS device includes a frame, a proof mass, and one or more curved cantilevers coupled between the frame and the proof mass. The one or more curved cantilevers have curved outer surfaces. The curved outer surfaces have a plurality of inflection points respectively arranged between turning points. The one or more curved cantilevers include four curved cantilevers respectively arranged along a different side of the proof mass.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ting-Jung Kaohsiung City, TW 31 27

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