METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, ACTIVE METAL PASTE, CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Nov 20, 2024
filing date -
Nov 20, 2024
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Abstract
A method for producing an active metal paste according to an embodiment includes a premixing process and a kneading process. The premixing process includes producing a mixture by mixing a binder with a metal powder; the metal powder includes copper and an active metal; the binder includes a resin dissolved in an organic solvent; and the mixture includes 60 to 95 mass % of the metal powder. The kneading process includes producing an active metal paste by causing the mixture to rotate and revolve.
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