METHOD FOR MANUFACTURING ULTRASONIC TRANSDUCER, ULTRASONIC TRANSDUCER, AND DISTANCE MEASURING EQUIPMENT

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United States of America

APP PUB NO 20250073751A1
SERIAL NO

18723878

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Abstract

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A method for manufacturing an ultrasonic transducer comprises the following steps: A first SOI substrate including a first silicon film, a second silicon film, and an intermediate silicon oxide film sandwiched between the first silicon film and the second silicon film is prepared. A piezoelectric element is formed on the first silicon film of the first SOI substrate. The second silicon film is etched to form a diaphragm. A silicon substrate is connected to the second silicon film. An opening and a gap are formed in an acoustically resonant structure including the first SOI substrate and the silicon substrate and the diaphragm and the acoustically resonant structure are also matched in resonant frequency so as to amplify vibration of a sonic wave of the diaphragm.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONCHIYODA-KU TOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRATA, Yoshiaki Chiyoda-ku, Tokyo, JP 26 231
KAJIYAMA, Yoshitaka Chiyoda-ku, Tokyo, JP 17 78

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