PRINTED WIRING BOARD
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United States of America
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N/A
Issued Date -
Feb 20, 2025
app pub date -
Dec 21, 2022
filing date -
Dec 21, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A printed wiring board includes: a first conductive pattern; a dielectric layer that is disposed to cover the first conductive pattern; a second conductive pattern that is disposed on the dielectric layer; and a plating layer. A thickness of the dielectric layer is 50 μm or more and 500 μm or less. A hole from which the first conductive pattern is exposed is formed in the dielectric layer. An aspect ratio of the hole is 0.5 or more and 2.0 or less. The plating layer is disposed on at least an inner wall surface of the hole and the first conductive pattern exposed from the hole, and electrically connected to the second conductive pattern. A thickness of the plating layer disposed on the first conductive pattern exposed from the hole is greater than a thickness of the second conductive pattern.
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