BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE USING THE APPARATUS
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Aug 18, 2023
filing date -
Aug 18, 2023
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Abstract
A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.
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