SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Nov 6, 2024
filing date -
Nov 6, 2024
priority date (Note) -
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Abstract
A semiconductor device includes a substrate, a stiffener ring over the substrate, and an adhesive ring between the substrate and the stiffener ring. The adhesive ring includes a first part, a second part and a third part disposed between the first part and the second part. The first part and the second part have a first thickness, and the third part has a second thickness greater than the first thickness. The third part of the adhesive ring is covered by the stiffener ring.
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