STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Aug 16, 2023
filing date -
Aug 16, 2023
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Abstract
Disclosed are devices in which a die, such as a system-on-chip (SoC) die is attached to an interposer with a mold. Unlike convention devices, the contact area for adhesion is increased by providing vertical surfaces in addition to lateral surfaces for attachment. In so doing, possibility of delamination is decreased significantly.
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