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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SAMSUNG ELECTRONICS CO LTD	SUWON-SI
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION	1 GWANAK-RO GWANAK-GU SEOUL 08826

International Classification(s)

• C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ahn, Cheol-Hee	Seoul, KR	7	70
Hong, Yooseon	Seoul, KR	1	0
Kim, Hyungjun	Suwon-si, KR	145	1302

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Aug 20, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Aug 20, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Aug 20, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2025/0062,152

DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING THE SAME

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