ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Feb 20, 2025
app pub date -
Dec 20, 2022
filing date -
Dec 20, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electrolytic solution for a copper foil, and the preparation and use of an electrolytic copper foil. The electrolytic solution for a copper foil comprises an additive, wherein the additive comprises an inhibitor and an auxiliary agent. The auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate, wherein both the alkyl sulfonate and the alkyl benzene sulfonate have ≥12 carbon atoms. By means of simple and convenient chemical regulation and control means such as the selection and combination of additives for an electrolytic (electroplating) solution, a pre-electroplated copper material resulting from electroplating using the electrolytic solution can form a high-proportion annealing twin boundary after a heat treatment at a temperature of ≥200° C., and has the unique mechanical characteristic of “annealing-induced strengthening and toughening”.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully