ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE USING THE SAME

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United States of America

APP PUB NO 20250059405A1
SERIAL NO

18723113

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Abstract

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A film for bonding semiconductors, which easily controls the fillet while exhibiting excellent adhesion force, and can prevent a problem in which solder is melted and fused to a chip; and a semiconductor package using the same.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Eun Byurl Daejeon, KR 7 6
JEONG, Min Su Daejeon, KR 12 17
KIM, Jung Hak Daejeon, KR 63 278
KIM, Ki Beom Daejeon, KR 23 154

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