MICRO-ELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE AND MEMS MICROPHONE COMPRISING SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250059024A1
SERIAL NO

18701569

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Abstract

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Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

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Patent Owner(s)

  • MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HU, Wei Suzhou, Jiangsu, CN 354 5894
MENG, Yanzi Suzhou, Jiangsu, CN 4 0
RONG, Genlan Suzhou, Jiangsu, CN 3 6
SUN, Kai Suzhou, Jiangsu, CN 143 634

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