FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Aug 17, 2023
filing date -
Aug 17, 2023
priority date (Note) -
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Abstract
A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.
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