METHOD OF GRINDING WAFER
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United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
After a first recess whose bottom is of a shape represented by a side surface of an inverted cone is formed in a reverse side of a wafer and before a second recess whose bottom is of a circular shape is formed in the reverse side of the wafer, a chuck table and a spindle are spaced from each other to separate a plurality of grindstones and the reverse side of the wafer from each other, and then a tilt of at least one of the chuck table or the spindle is adjusted to change an angle formed between a rotational axis about which the chuck table is rotatable and a rotational axis about which the spindle is rotatable.
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