SEMICONDUCTOR ULTRASONIC TRANSDUCER DEVICE AND METHODS OF FORMATION
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 20, 2025
app pub date -
Aug 16, 2023
filing date -
Aug 16, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A micro-electromechanical-system (MEMS) device may include a capacitive micromachined ultrasonic transducer (CMUT) that includes an actuation membrane and a sensing dielectric layer that are spaced apart by a cavity. The sensing dielectric layer may be formed such that the thickness of the sensing dielectric layer may extend the operational of the CMUT while enabling the CMUT to accommodate a sufficiently high direct current voltage bias for collapsed mode operation. In this way, the thickness of the sensing dielectric layer enables the CMUT to operate in the collapsed mode, which enables the CMUT to achieve greater sound pressure output relative to other operational modes and enables the frequency response of the CMUT to be adjustable, thereby enabling the frequency response to be optimized for specific use cases and applications.
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International Classification(s)
- 2023 Application Filing Year
- B06B Class
- 221 Applications Filed
- 52 Patents Issued To-Date
- 23.53 % Issued To-Date
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