TOUCH-SENSITIVE ASSEMBLY AND METHOD FOR PRODUCING A TOUCH-SENSITIVE ASSEMBLY
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Dec 16, 2022
filing date -
Dec 16, 2022
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Abstract
A touch-sensitive arrangement includes a carrier, an electrode layer, at least one light-emitting semiconductor body, and an encapsulation layer. The electrode layer is arranged between the carrier and the encapsulation layer and includes a first number N of detection areas and a second number M of illuminating areas. A detection area of the first number N of detection areas includes a first electrode. An illuminating area of the second number M of illuminating areas includes a first and a second contact connection line. The first contact connection line is coupled to a first terminal of the at least one light-emitting semiconductor body and the second contact connection line is coupled to a second terminal of the at least one light-emitting semiconductor body.
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