OPTOELECTRONIC ELEMENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC ELEMENT
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Nov 24, 2022
filing date -
Nov 24, 2022
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Abstract
An optoelectronic element includes a carrier, a semiconductor chip with an active layer for generating electromagnetic radiation, and an encapsulation element. The semiconductor chip is arranged on a main surface of the carrier. The encapsulation element is arranged on the main surface of the carrier, such that the optoelectronic element includes an intermediate space between the main surface of the carrier and the encapsulation element. The semiconductor chip is arranged in the intermediate space. The intermediate space is at least partially filled with hollow beads.
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