HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
May 16, 2024
filing date -
May 16, 2024
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Abstract
Provided herein may be a heat dissipation module including a first planar component, a partition wall coupled to the first planer component and defining a first path having one side closed by the first planar component, the first path forming a closed loop, and working fluid disposed in the first path. The heat dissipation module and an electronic device including the heat dissipation module in accordance with embodiments may be improved in heat dissipation efficiency.
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