Solder Mask Arrangement for a Component Carrier

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250056735A1
SERIAL NO

18932966

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Abstract

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A component carrier system with a component carrier, a base solder mask layer formed on a surface of the component carrier, and a top solder mask layer formed on top of a predefined section of the base solder mask. The predefined section of the base solder mask covers a target section of the component carrier.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bin, Ismail Ismadi Kuching, MY 2 0
Chiu, Fanyi Taipei, TW 2 0

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