PRINTED CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Apr 11, 2024
filing date -
Apr 11, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers; an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers; and an insulating film disposed in the plurality of insulating layers, and covering at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion.
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