CORE MODULES AND EARPHONES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250056143A1
SERIAL NO

18929658

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided are a core module and an earphone. The core module may include a core housing, and a speaker and a bracket provided in the core housing. The bracket and the speaker may enclose to form an acoustic cavity, the core housing may be provided with an acoustic hole, the bracket may be provided with an acoustic channel connecting the acoustic hole and the acoustic cavity, the bracket may cooperate with the core housing to form a first adhesive-containing groove surrounding at least a portion of the acoustic hole, and the first adhesive-containing groove may contain a first adhesive for sealing an assembly gap between the bracket and the core housing.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN SHOKZ CO LTDFLOORS 1-4 FACTORY BUILDING 26 SHANCHENG INDUSTRIAL PARK SHIYAN STREET BAO'AN DISTRICT SHENZHEN GUANGDONG 518108 518108

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LI, Yongjian Shenzhen, CN 142 379
WU, Duoduo Shenzhen, CN 54 46
XU, Jiang Shenzhen, CN 133 441
ZHANG, Haofeng Shenzhen, CN 119 556

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