INTERPOSER AND FABRICATION THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250054883A1
SERIAL NO

18244320

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An interposer includes a substrate having an inductor forming region thereon, a plurality of trenches within the inductor forming region in the substrate, a buffer layer lining interior surfaces of the plurality of trenches and forming air gaps within the plurality of trenches, and an inductor coil pattern embedded in the buffer layer within the inductor forming region.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Chung-Yi Tainan City, TW 75 269
Lin, Da-Jun Kaohsiung City, TW 67 39
Tsai, Bin-Siang Changhua County, TW 102 86
Tsai, Fu-Yu Tainan City, TW 65 72

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