SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Jan 30, 2024
filing date -
Jan 30, 2024
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Abstract
An embodiment provides a semiconductor package including: a substrate having a first surface and a second surface disposed in an opposite direction to the first surface; a semiconductor chip disposed on at least one surface of the substrate; an electronic device disposed on the second surface of the substrate; a first molding layer disposed on the first surface of the substrate; and a second molding layer disposed on the second surface of the substrate, wherein the second molding layer has an open hole that exposes at least a portion of the electronic device to the outside, and a material of the second molding layer is located on an inner surface of the open hole.
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