PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250054794A1
SERIAL NO

18933717

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a processing method including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber when it is determined that a maintenance timing is reached based on information comprising at least the number of processed substrates; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

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Patent Owner(s)

  • KOKUSAI ELECTRIC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUI, Shun Toyama-shi, JP 54 94
MIZUGUCHI, Yasuhiro Toyama-shi, JP 20 38
OHASHI, Naofumi Toyama-shi, JP 148 697
TAKASAKI, Tadashi Toyama-shi, JP 48 66

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