SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Dec 26, 2022
filing date -
Dec 26, 2022
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Abstract
A substrate processing apparatus etches a molybdenum film of a substrate having a device structure that includes, in a multistage manner, multilayer films including the molybdenum film. A processing tank retains therein etchant including acetic acid, phosphoric acid, nitric acid, and water as components. A controller is configured to: based on concentrations of the components, an amount of the etchant, a preliminarily-set target amount of the etchant, and preliminarily-set target concentrations of the respective components; decide a discharging amount of the etchant from the processing tank, and replenishing amounts of acetic acid, phosphoric acid, and nitric acid to the processing tank; control an open/close valve to discharge the decided discharging amount of the etchant from the processing tank; and control a supply unit to replenish the processing tank with the decided replenishing amounts of acetic acid, phosphoric acid, and nitric acid.
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