DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRADIATION
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Aug 7, 2024
filing date -
Aug 7, 2024
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Abstract
Disclosed systems and techniques are directed to improvement of semiconductor manufacturing. In one disclosed embodiment, the disclosed systems and techniques include depositing one or more films on a front surface of a substrate, forming a stress compensation layer (SCL) on the one or more deposited films, the SCL causing stress in the substrate to be changed, subjecting the SCL to a stress-mitigation beam to reduce deformation of the substrate, and adding one or more features to at least one of the one or more deposited films.
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