THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR
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United States of America
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Feb 13, 2025
app pub date -
Oct 30, 2024
filing date -
Oct 30, 2024
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Abstract
A through-type multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, inner electrode layers laminated on the dielectric layers, first and second inner electrode layer, a first outer electrode on a first end surface of the multilayer body and connected to the first inner electrode layer, a second outer electrode on a second end surface of the multilayer body and connected to the first inner electrode layer, a third outer electrode on a first side surface of the multilayer body and connected to the second inner electrode layer, and a fourth outer electrode on a second side surface of the multilayer body and connected to the second inner electrode layer. The first outer electrode includes a first plating layer and a first charging electrode, and the second outer electrode includes a second plating layer and a second charging electrode.
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