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United States of America

APP PUB NO 20250053702A1
SERIAL NO

18928905

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Abstract

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A defect prediction method for a device manufacturing process involving processing a pattern onto a substrate, the method comprising: identifying a processing window limiting pattern (PWLP) from the pattern; determining a processing parameter under which the PWLP is processed; and determining or predicting, using the processing parameter, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the PWLP with the device manufacturing process.

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Patent Owner(s)

  • ASML NETHERLANDS B.V.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hunsche, Stefan Santa Clara, US 53 1042
Vellanki, Venugopal San Jose, US 11 43

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