POWER SENSOR ARRANGEMENT FOR ON-WAFER POWER CALIBRATION
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Aug 11, 2023
filing date -
Aug 11, 2023
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status (Latency Note)
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Abstract
The present disclosure relates to a power sensor arrangement for on-wafer power calibration including a power sensor(s). The power sensor(s) include: a first connection surface which is arranged to receive a probe tip of a probing device; a power measurement cell which is electrically connected to the first connection surface, wherein the power measurement cell is configured to measure a power level of an RF signal applied to the first connection surface; an analog-to-digital converter (ADC) which is configured to digitalize an output signal of the power measurement cell to generate a digitalized data stream; and an encoding unit configured to encode the digitalized data stream. The encoding unit is configured to output the encoded data stream to: the first connection surface, a second connection surface of the power sensor(s), or an antenna unit of the power sensor arrangement for forwarding the encoded data stream.
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