Assembly comprising a semiconductor component and a temperature sensor unit for measuring a temperature of the semiconductor component, and switch arrangement
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Jul 11, 2024
filing date -
Jul 11, 2024
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Abstract
An assembly includes a semiconductor component and a temperature sensor unit for measuring a temperature of the semiconductor component, wherein the semiconductor component comprises a recess, wherein the temperature sensor unit comprises a housing element and a temperature sensor element, wherein the housing element comprises a first housing section and a second housing section, wherein the second housing section protrudes from the first housing section, wherein the temperature sensor element is at least partially located in the second housing section, the second housing section projecting from the first housing section, the temperature sensor element being arranged at least partially in the second housing section, the second housing section being arranged in the recess of the semiconductor component, and a switch arrangement having at least one such assembly and at least one further semiconductor component.
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