THERMAL MANAGEMENT MODULE
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United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Aug 6, 2024
filing date -
Aug 6, 2024
priority date (Note) -
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Abstract
A thermal management module includes a thermal management component, a support component and a communication component. The support component includes a first surface and a second surface. The thermal management component is located at least partially on a side of the first surface. The communication component is located at least partially on a side of the second surface. The thermal management component is connected to the side of the first surface. The communication component is connected to the side of the second surface. The support component has a transfer hole communicating with the thermal management component and the communication component. The communication component has a channel communicating with the transfer hole. The thermal management component includes at least two sub-components. The thermal management module has a flow channel communicating with at least two sub-components. The transfer hole and the channel are at least part of the flow channel.
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