SUBSTRATE-PROCESSING APPARATUS AND SUBSTRATE-PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250051920A1
SERIAL NO

18788436

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Abstract

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A substrate-processing apparatus includes a process chamber configured to process a plurality of substrates; a rotation table that is disposed in an interior of the process chamber so as to be rotatable and at which the substrates are to be placed at positions that are away in a radial direction of the rotation table from a center of rotation of the rotation table; a supply member configured to supply gas to the substrates placed on the rotation table; and a raising and lowering mechanism configured to raise and lower the supply member relative to the rotation table.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKADA, Takehiro Iwate, JP 6 275
FUKUSHI, Yudai Iwate, JP 11 3
TAGUCHI, Junnosuke Iwate, JP 17 21
TAKEUCHI, Yasushi Iwate, JP 113 1569

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