CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELEMENT HAVING CONTACT ELECTRODE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250051573A1
SERIAL NO

18720896

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention aims to provide a curable resin composition capable of forming a film which, even when made thick, is less likely to crack at high temperature under a nitrogen atmosphere, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: a polyimide; and a silsesquioxane, the polyimide being contained in an amount of 0.5 parts by weight or more and 50 parts by weight or less relative to 100 parts by weight of the silsesquioxane.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • SEKISUI CHEMICAL CO. LTD

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DEGUCHI, Hidenobu Osaka, JP 9 63
NOMOTO, Hayate Osaka, JP 2 0
SATO, Kenichiro Osaka, JP 122 1201
SHICHIRI, Tokushige Osaka, JP 10 57
SHIOJIMA, Taro Osaka, JP 3 0

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation