SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAME
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 13, 2025
app pub date -
Oct 29, 2024
filing date -
Oct 29, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A method for joining ceramic pieces includes placing a layer of titanium on each of a first ceramic piece and a second ceramic piece; placing a layer of nickel on each of the layers of titanium; assembling the first ceramic piece and the second ceramic piece with the layers of nickel and the layers of titanium between the ceramic pieces; pressing the first ceramic piece and the second ceramic piece with the layers of nickel and the layers of titanium together; heating the first ceramic piece, the second ceramic piece, the layers of nickel, and the layers of titanium to a joining temperature in a vacuum; and cooling the first ceramic piece, the second ceramic piece, the layers of nickel, and the layers of titanium to create a hermetic seal between the first ceramic piece and the second ceramic piece.
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International Classification(s)
- 2024 Application Filing Year
- H01L Class
- 12855 Applications Filed
- 458 Patents Issued To-Date
- 3.57 % Issued To-Date
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