SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250048781A1
SERIAL NO

18365678

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Abstract

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A modulator heater structure may include a plurality of regions having different thicknesses. For example, a heater ring of the modulator heater structure may have a first thickness. A heater pad of the modulator heater structure, that is configured to provide an electrical current to the heater ring, may have a second thickness that is greater than the first thickness. The lesser thickness of the heater ring of the modulator heater structure provides high electrical resistance in the heater ring, which enables the heater ring to quickly and efficiently generate heat. The greater thickness of the heater pad provides low electrical resistance in the second region, which enables the electrical current to be efficiently provided through the heater pad to the heater ring with reduced heat dissipation in the hear pad due to the lower electrical current dissipation in the heater pad.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN ROAD 6 HSINCHU SCIENCE PARK HSINCHU 300

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Shih-Fen Jhubei, TW 87 331
LO, Wen-Shun Hsinchu County, TW 32 65
SHIH, Chi-Yuan Hsinchu, TW 74 698
TSUI, YingKit Felix Cupertino, US 48 6
YANG, Jing-Hwang Zhubei City, TW 20 120
YEH, Sheng Kai Taichung City, TW 5 0

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