SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Oct 19, 2023
filing date -
Oct 19, 2023
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Abstract
Semiconductor devices and methods of manufacture are presented. In embodiments a method of manufacturing the semiconductor device includes forming a fin from a plurality of semiconductor materials, depositing a dummy gate over the fin, depositing a plurality of spacers adjacent to the dummy gate, removing the dummy gate to form an opening adjacent to the plurality of spacers, widening the opening adjacent to a top surface of the plurality of spacers, after the widening, removing one of the plurality of semiconductor materials to form nanowires, and depositing a gate electrode around the nanowires.
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