COOLING APPARATUS FOR POWER MODULE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250048589A1
SERIAL NO

18923003

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

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Patent Owner(s)

  • HYUNDAI MOTOR COMPANY; KIA CORPORATION; CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANG, Min Soo Seoul, KR 81 742
KIM, Yun Seo Seoul, KR 2 2
KONG, Dae Young Seoul, KR 3 2
KWON, Se Heun Incheon, KR 9 6
LEE, Geon Hee Seoul, KR 11 73
LEE, Hyoung Soon Seoul, KR 7 2
LEE, Je Hwan Seongnam-si, KR 11 23
LEE, Sang Hun Taebaek-si, KR 218 1251
LEE, Seong Min Seoul, KR 177 1113
PARK, Hyong Joon Hwaseong-si, KR 15 76

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