Core Resonance Suppression in Signal Integrity Optimized Package

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250048535A1
SERIAL NO

18362518

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Abstract

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A signal integrity optimized package is provided. An apparatus includes a core comprising a top surface, bottom surface, and a first plane coupled to the top surface of the core. The first plane includes a first region circumscribed by a first ditch, wherein the first region includes an electrically conductive material, and wherein the first ditch is configured to electrically isolate the first region.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED1 YISHUN AVENUE 7 SINGAPORE 768923

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jiang, Kun Timnath, US 43 36

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