PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Oct 19, 2023
filing date -
Oct 19, 2023
priority date (Note) -
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Abstract
A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.
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