Importance

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Abstract

A method for manufacturing an electrically conductive channel structure in a substrate has the following steps: (−) providing a stack arrangement in a clamping device, the stack arrangement having a substrate provided with a channel structure, a metal film having an aluminum material (=also an aluminum material alloy) on the substrate, and a compressible sealing element which at least laterally surrounds the metal film while exerting pressure, (−) applying a planar-acting mechanical process pressure and a process temperature to the stack arrangement with the clamping device in order to melt the metal film having the aluminum material at the process temperature and to introduce it into the channel structure as metallic filling material by means of the planar-acting mechanical process pressure, and (−) cooling the stack arrangement to solidify the introduced metallic filling material and to obtain the electrically conductive channel structure filled with the metallic filling material.

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First Claim