IC PACKAGE WITH IMMERSION TIN ON FLANK
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Jul 31, 2023
filing date -
Jul 31, 2023
priority date (Note) -
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Abstract
A method for forming integrated circuit (IC) packages includes mounting tape on a mold compound of a strip of flat no-leads IC packages. The method also includes sawing the mold compound of the strip of flat no-leads IC packages to form singulated IC packages mounted on the tape. The method further includes immersing the singulated IC packages in a bath of immersion tin to form immersion tin plating on a flank of leads of the singulated IC packages.
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