SUBSTRATE PROCESSING METHOD, COMPUTER RECORDING MEDIUM, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING APPARATUS
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Oct 21, 2024
filing date -
Oct 21, 2024
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Abstract
A substrate processing method includes: (A) applying a resist liquid on a substrate to form a resist film, (B) performing auxiliary exposure processing of irradiating the resist film with light having a desired wavelength, separately from exposure processing of transferring a pattern of a mask onto the resist film, (C) supplying a developer to the resist film after the exposure processing and the auxiliary exposure processing to form a resist pattern, (D) etching an etching target layer on the substrate using the resist pattern as a mask, and (E) correcting an in-plane distribution of an exposure amount in the auxiliary exposure processing in (B), and performing the correction based on a result of (D) when (A) to (D) are performed under conditions before the correction.
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