ULTRATHIN FILM SHADOW MASK FOR LITHOGRAPHY AND LITHOGRAPHY METHOD USING THE SAME
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United States of America
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Feb 6, 2025
app pub date -
Dec 19, 2023
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Dec 19, 2023
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Abstract
Provided are a new ultrathin film silicon shadow mask which is flexible, is reusable, and can be precisely aligned and manipulated through transfer printing, and a lithography method using the same. A thin thickness of a silicon shadow mask may intrinsically form a pattern having an enhanced resolution in a plane and a non-planar surface. Further, the silicon shadow mask may be formed on a substrate by metal deposition in addition to etching in a multi-layer configuration by a transfer printing technology based alignment method. Through such a method, a material in which patterning is impossible may be patterned through photolithography.
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