SYSTEMS AND METHODS FOR HIGH DENSITY ELECTROCHEMICAL ADDITIVE MANUFACTURING WITH CMOS MICROANODE ARRAY
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Jul 31, 2023
filing date -
Jul 31, 2023
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Abstract
The present disclosure relates to an additive manufacturing system for forming a part. In one embodiment the system may make use of a controller for generating 2D pattern data for printing a part. A cathode may be used which is adapted to be disposed in a solution contained within a reservoir. The cathode is configured for facilitating electrodeposition to form a part thereon. A printhead is provided which has a plurality of microanodes forming a microanode array, and which is in communication with the controller. The printhead is disposed adjacent to the cathode and configured to receive and use the 2D pattern data to generate current signals applied to the microanodes. The microanodes cause electrodeposition of metal, using the solution, on the cathode at a plurality of select locations on the cathode, and in parallel.
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