SILVER PLATING SOLUTION
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Nov 21, 2022
filing date -
Nov 21, 2022
priority date (Note) -
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Abstract
An electroless silver plating solution is provided. The electroless silver plating solution includes a silver complex solution and a reducing agent solution. The silver complex solution includes a silver carboxylate represented by Formula 1: R1—COOAg, a nitrogen-containing compound as a complexing agent, and a solvent. The reducing agent solution includes a reducing agent selected from the group consisting of glucose, hydrazine, hydroquinone, and derivatives thereof and a solvent. The electroless silver plating is based on a silver mirror reaction between the silver complex solution and the reducing agent solution.
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