CURABLE COMPOSITION, FILM FORMING METHOD AND ARTICLE MANUFACTURING METHOD
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United States of America
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Feb 6, 2025
app pub date -
Oct 10, 2024
filing date -
Oct 10, 2024
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Abstract
A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPas and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.
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