POLYIMIDE FILM, HIGH-FREQUENCY CIRCUIT SUBSTRATE, AND FLEXIBLE ELECTRONIC DEVICE SUBSTRATE
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United States of America
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Issued Date -
Feb 6, 2025
app pub date -
Nov 30, 2022
filing date -
Nov 30, 2022
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Abstract
A polyimide film including a polyimide prepared by reacting a tetracarboxylic acid component with a diamine component containing 4,4″-diamino-p-terphenyl, wherein the polyimide film has a glass transition temperature of higher than 290° C., and has a coefficient of linear expansion in the temperature range of 50° C. to 200° C. of 10 ppm/K or less.
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