METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Jul 26, 2023
filing date -
Jul 26, 2023
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Abstract
An article comprising an electrically-conductive metal-containing pattern is provided by: A-1) providing a pattern of a catalytic ink on a surface of a first substrate; A-2) curing the pattern of the catalytic ink sufficient to form a cured catalytic ink pattern; A-3) electrolessly plating a metal on the cured catalytic ink pattern to form a metallic pattern on the cured catalytic ink pattern; B) applying a first darkening agent directly to a first surface of the metallic pattern to form a first darkened surface; C) transferring the metallic pattern to a second substrate so that the first darkened surface is in direct contact with the surface of the second substrate, leaving an undarkened second surface of the metallic pattern exposed to view; and D) applying a second darkening agent directly to the undarkened second surface of the metallic pattern, to form a second darkened surface of the metallic pattern.
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